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Proceedings Paper

Evaluation of anti-sticking layers performances for 200mm wafer scale Smart NILTM process through surface and defectivity characterizations
Author(s): F. Delachat; J.-C. Phillipe; V. Larrey; F. Fournel; S. Bos; H. Teyssèdre ; Xavier Chevalier; Célia Nicolet; Christophe Navarro; Ian Cayrefourcq
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Paper Abstract

In this work, an evaluation of various ASL processes for 200 mm wafer scale in the HERCULES® NIL equipment platform available at the CEA-Leti through the INSPIRE program is reported. The surface and adherence energies were correlated to the AFM and defectivity results in order to select the most promising ASL process for high resolution etch mask applications. The ASL performances of the selected process were evaluated by multiple working stamp fabrication using unpatterned and patterned masters though defectivity monitoring on optical based-inspection tools. Optical and SEM defect reviews were systematically performed. Multiple working stamps fabrication without degradation of the master defectivity was witnessed. This evaluation enabled to benchmark several ASL solutions based on the grafted technology develop by ARKEMA in order to reduce and optimize the soft stamp defectivity prior to its replication and therefore considerably reduce the final imprint defectivity for the Smart NIL process.

Paper Details

Date Published: 13 March 2018
PDF: 8 pages
Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058615 (13 March 2018); doi: 10.1117/12.2298407
Show Author Affiliations
F. Delachat, CEA-LETI (France)
INTITEK (France)
J.-C. Phillipe, CEA-LETI (France)
V. Larrey, CEA-LETI (France)
F. Fournel, CEA-LETI (France)
S. Bos, CEA-LETI (France)
H. Teyssèdre , CEA-LETI (France)
Xavier Chevalier, Arkema S.A. (France)
Célia Nicolet, Arkema S.A. (France)
Christophe Navarro, Arkema S.A. (France)
Ian Cayrefourcq, Arkema S.A. (France)

Published in SPIE Proceedings Vol. 10586:
Advances in Patterning Materials and Processes XXXV
Christoph K. Hohle, Editor(s)

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