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Proceedings Paper

Chip to chip optical interconnects in a multichip module architecture
Author(s): James A. Holmes
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Paper Abstract

This paper examines the chip to chip integration of optical interconnects (01). A multilevel planar architecture for chip to chip optical interconnection using a carrier wavelength of 0.94 pm and Si3N4 waveguides on an AN Multichip Module (MCM) substrate is proposed. The use of turning mirrors, microlenses and other optical elements to improve the loss budget are presented.

Paper Details

Date Published: 14 December 1992
PDF: 2 pages
Proc. SPIE 1929, 17th International Conference on Infrared and Millimeter Waves, 19295O (14 December 1992); doi: 10.1117/12.2298321
Show Author Affiliations
James A. Holmes, The Univ. of Connecticut (United States)


Published in SPIE Proceedings Vol. 1929:
17th International Conference on Infrared and Millimeter Waves
Richard J. Temkin, Editor(s)

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