Share Email Print
cover

Proceedings Paper

Aerial image based metrology of EUV masks: recent achievements, status, and outlook for the AIMS EUV platform
Author(s): Renzo Capelli; Dirk Hellweg; Martin Dietzel; Markus Koch; Conrad Wolke; Grizelda Kersteen
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

For upcoming EUV high volume manufacturing, the EUV mask infrastructure plays a central role for its successful introduction. One of the key items in the EUV mask infrastructure is the need of manufacturing defect free photomasks for which an actinic mask review capability is a critical success factor. ZEISS and the SUNY POLY SEMATECH EUVL Mask Infrastructure consortium have developed and commercialized the EUV aerial image metrology system, the AIMS™ EUV. In this paper we present the latest achievements of this AIMS™ EUV platform together with data and analysis of LER/LWR measurements in the aerial image. We provide an overall project overview and discuss possible future extensions options based on this actinic metrology platform.

Paper Details

Date Published: 19 March 2018
PDF: 11 pages
Proc. SPIE 10583, Extreme Ultraviolet (EUV) Lithography IX, 1058311 (19 March 2018); doi: 10.1117/12.2297681
Show Author Affiliations
Renzo Capelli, Carl Zeiss SMT GmbH (Germany)
Dirk Hellweg, Carl Zeiss SMT GmbH (Germany)
Martin Dietzel, Carl Zeiss SMT GmbH (Germany)
Markus Koch, Carl Zeiss SMT GmbH (Germany)
Conrad Wolke, Carl Zeiss SMT GmbH (Germany)
Grizelda Kersteen, Carl Zeiss SMT GmbH (Germany)


Published in SPIE Proceedings Vol. 10583:
Extreme Ultraviolet (EUV) Lithography IX
Kenneth A. Goldberg, Editor(s)

© SPIE. Terms of Use
Back to Top