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Study of µDBO overlay target size reduction for application broadening
Author(s): Victor Calado; Jérôme Dépré; Clément Massacrier; Sergey Tarabrin; Richard van Haren; Florent Dettoni; Régis Bouyssou; Christophe Dezauzier
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Paper Abstract

With these proceedings we present μ-diffraction-based overlay (μDBO) targets that are well below the currently supported minimum size of 10×10 μm2 . We have been capable of measuring overlay targets as small as 4×4 μm2 with our latest generation YieldStar system. Furthermore we find an excellent precision (TMU < 0.33 nm for 6 × 6 μm2 ) without any compromise on throughput (MAM time < 60 ms). At last a study that compares four generations of YieldStar systems show clearly that the latest generation YieldStar systems is much better capable of reading small overlay targets such that the performance of a 16 × 16 μm2 on an early generation YieldStar 2nd-gen is comparable to that of a 8 × 8 μm2 on the latest YieldStar 5th-gen. This work enables a smaller metrology footprint, more placement flexibility and in-die overlay metrology solutions.

Paper Details

Date Published: 13 March 2018
PDF: 8 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058507 (13 March 2018); doi: 10.1117/12.2297673
Show Author Affiliations
Victor Calado, ASML Netherlands B.V. (Netherlands)
Jérôme Dépré, ASML Netherlands B.V. (Netherlands)
Clément Massacrier, ASML Netherlands B.V. (Netherlands)
Sergey Tarabrin, ASML Netherlands B.V. (Netherlands)
Richard van Haren, ASML Netherlands B.V. (Netherlands)
Florent Dettoni, STMicroelectronics S.A. (France)
Régis Bouyssou, STMicroelectronics S.A. (France)
Christophe Dezauzier, STMicroelectronics S.A. (France)


Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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