Share Email Print

Proceedings Paper • new

Assessment of local variability by high-throughput e-beam metrology for prediction of patterning defect probabilities
Author(s): Fuming Wang ; Stefan Hunsche; Roy Anunciado; Antonio Corradi ; Hung Yu Tien; Peng Tang; Junwei Wei; Yongjun Wang; Wei Fang; Patrick Wong; Anton van Oosten; Koen van Ingen Schenau; Bram Slachter
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We present an experimental study of pattern variability and defectivity, based on a large data set with more than 112 million SEM measurements from an HMI high-throughput e-beam tool. The test case is a 10nm node SRAM via array patterned with a DUV immersion LELE process, where we see a variation in mean size and litho sensitivities between different unique via patterns that leads to a seemingly qualitative differences in defectivity. The large available data volume enables further analysis to reliably distinguish global and local CDU variations, including a breakdown into local systematics and stochastics. A closer inspection of the tail end of the distributions and estimation of defect probabilities concludes that there is a common defect mechanism and defect threshold despite the observed differences of specific pattern characteristics. We expect that the analysis methodology can be applied for defect probability modeling as well as general process qualification in the future.

Paper Details

Date Published: 13 March 2018
PDF: 8 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058525 (13 March 2018); doi: 10.1117/12.2297603
Show Author Affiliations
Fuming Wang , ASML US, Inc. (United States)
Stefan Hunsche, ASML US, Inc. (United States)
Roy Anunciado, ASML Netherlands B.V. (Netherlands)
Antonio Corradi , ASML Netherlands B.V. (Netherlands)
Hung Yu Tien, ASML US, Inc. (United States)
Peng Tang, ASML US, Inc. (United States)
Junwei Wei, ASML US, Inc. (United States)
Yongjun Wang, ASML US, Inc. (United States)
Wei Fang, ASML US, Inc. (United States)
Patrick Wong, IMEC (Belgium)
Anton van Oosten, ASML Netherlands B.V. (Netherlands)
Koen van Ingen Schenau, ASML Netherlands B.V. (Netherlands)
Bram Slachter, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

© SPIE. Terms of Use
Back to Top