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Proceedings Paper

Automated AFM for small-scale and large-scale surface profiling in CMP applications
Author(s): Ardavan Zandiatashbar; Byong Kim; Young-kook Yoo; Keibock Lee; Ahjin Jo; Ju Suk Lee; Sang-Joon Cho; Sang-il Park
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Paper Abstract

As the feature size is shrinking in the foundries, the need for inline high resolution surface profiling with versatile capabilities is increasing. One of the important areas of this need is chemical mechanical planarization (CMP) process. We introduce a new generation of atomic force profiler (AFP) using decoupled scanners design. The system is capable of providing small-scale profiling using XY scanner and large-scale profiling using sliding stage. Decoupled scanners design enables enhanced vision which helps minimizing the positioning error for locations of interest in case of highly polished dies. Non-Contact mode imaging is another feature of interest in this system which is used for surface roughness measurement, automatic defect review, and deep trench measurement. Examples of the measurements performed using the atomic force profiler are demonstrated.

Paper Details

Date Published: 13 March 2018
PDF: 6 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852U (13 March 2018); doi: 10.1117/12.2297521
Show Author Affiliations
Ardavan Zandiatashbar, Park Systems Inc. (United States)
Byong Kim, Park Systems Inc. (United States)
Young-kook Yoo, Park Systems Inc. (United States)
Keibock Lee, Park Systems Inc. (United States)
Ahjin Jo, Park Systems Corp. (Korea, Republic of)
Ju Suk Lee, Park Systems Corp. (Korea, Republic of)
Sang-Joon Cho, Park Systems Corp. (Korea, Republic of)
Sang-il Park, Park Systems Corp. (Korea, Republic of)

Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

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