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Proceedings Paper

Minimum reaction network necessary to describe Ar/CF4 plasma etch
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Paper Abstract

Predicting the etch and deposition profiles created using plasma processes is challenging due to the complexity of plasma discharges and plasma-surface interactions. Volume-averaged global models allow for efficient prediction of important processing parameters and provide a means to quickly determine the effect of a variety of process inputs on the plasma discharge. However, global models are limited based on simplifying assumptions to describe the chemical reaction network. Here a database of 128 reactions is compiled and their corresponding rate constants collected from 24 sources for an Ar/CF4 plasma using the platform RODEo (Recipe Optimization for Deposition and Etching). Six different reaction sets were tested which employed anywhere from 12 to all 128 reactions to evaluate the impact of the reaction database on particle species densities and electron temperature. Because many the reactions used in our database had conflicting rate constants as reported in literature, we also present a method to deal with those uncertainties when constructing the model which includes weighting each reaction rate and filtering outliers. By analyzing the link between a reaction’s rate constant and its impact on the predicted plasma densities and electron temperatures, we determine the conditions at which a reaction is deemed necessary to the plasma model. The results of this study provide a foundation for determining which minimal set of reactions must be included in the reaction set of the plasma model.

Paper Details

Date Published: 20 March 2018
PDF: 8 pages
Proc. SPIE 10589, Advanced Etch Technology for Nanopatterning VII, 105890J (20 March 2018); doi: 10.1117/12.2297502
Show Author Affiliations
Sofia Helpert, The Univ. of Texas at Austin (United States)
Meghali Chopra, The Univ. of Texas at Austin (United States)
SandBox Semiconductor (United States)
Roger T. Bonnecaze, The Univ. of Texas at Austin (United States)
SandBox Semiconductor (United States)

Published in SPIE Proceedings Vol. 10589:
Advanced Etch Technology for Nanopatterning VII
Sebastian U. Engelmann, Editor(s)

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