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Proceedings Paper

Reduction in overlay error from mark asymmetry using simulation, ORION, and alignment models
Author(s): Boris Menchtchikov; Robert Socha; Chumeng Zheng; Sudhar Raghunathan; Igor Aarts; Krishanu Shome; Jonathan Lee; Chris de Ruiter; Manouk Rijpstra; Henry Megens; Ralph Brinkhof; Floris Teeuwisse; Leendertjan Karssemeijer; Irina Lyulina; Chung-Tien Li; Jan Hermans; Philippe Leray
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Paper Abstract

Three methods to minimize the impact of alignment mark asymmetry on overlay variation are demonstrated. These methods are measurement based optimal color weighting (OCW), simulation based optimal color weighting, and wafer alignment model mapping (WAMM). Combination of WAMM and OCW methods delivers the highest reduction in overlay variation of 1.3nm (X direction) and 1.2nm (Y direction) as compared to best single color recipe. Simulation based OCW produces a similar reduction in overlay variation as compared to measurement based OCW, and simulation based OCW has the advantage that the scanner alignment recipe with optimize weights can be determined before the mark asymmetry excursion has occurred. Finally, WAMM is capable of reducing the contribution of mark asymmetry on overlay by using a more optimal high order wafer alignment recipe. Capabilities of WAMM can also be combined with OCW solutions.

Paper Details

Date Published: 20 March 2018
PDF: 10 pages
Proc. SPIE 10587, Optical Microlithography XXXI, 105870C (20 March 2018); doi: 10.1117/12.2297493
Show Author Affiliations
Boris Menchtchikov, ASML US, Inc. (United States)
Robert Socha, ASML US, Inc. (United States)
Chumeng Zheng, ASML US, Inc. (United States)
Sudhar Raghunathan, ASML US, Inc. (United States)
Igor Aarts, ASML US, Inc. (United States)
Krishanu Shome, ASML US, Inc. (United States)
Jonathan Lee, ASML US, Inc. (United States)
Chris de Ruiter, ASML Netherlands B.V. (Netherlands)
Manouk Rijpstra, ASML Netherlands B.V. (Netherlands)
Henry Megens, ASML Netherlands B.V. (Netherlands)
Ralph Brinkhof, ASML Netherlands B.V. (Netherlands)
Floris Teeuwisse, ASML Netherlands B.V. (Netherlands)
Leendertjan Karssemeijer, ASML Netherlands B.V. (Netherlands)
Irina Lyulina, ASML Netherlands B.V. (Netherlands)
Chung-Tien Li, ASML Netherlands B.V. (Netherlands)
Jan Hermans, IMEC (Belgium)
Philippe Leray, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10587:
Optical Microlithography XXXI
Jongwook Kye, Editor(s)

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