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Proceedings Paper

High-precision 3D printing as a versatile tool for integrated photonics (Conference Presentation)
Author(s): Benedikt Stender; Willi Mantei; Alexander Krupp; Valentin Ratz; Fabian Hilbert; Ruth Houbertz

Paper Abstract

Driven by IoT, Industry 4.0, and social media the amount of data to be transferred is tremendously increasing, pushing the need for energy-efficient device concepts for a vast variety of products such as photonic integrated circuits or sensors. Low energy data transfer can be achieved, for example, by replacing part of the electronic circuitry by optical data lines in chip-level packaging, or by introducing optical elements such as specially designed microlenses into semiconductor laser packaging. This also allows to drastically reduce footprints of systems, and – at the same time – to increase functionality. On the other hand, a significant demand is seen in providing lower cost and scalable manufacturing processes with technologies which provide highest flexibility. High Precision 3D Printing as novel emerging fabrication technology is a promising tool for optical packaging. It enables to reduce the necessary process steps for packaging to only three to five, independently of the packaging task. This is enabled by a novel and versatile packaging concept where the chips and the dies are already mounted prior to the fabrication of optically functional elements such as optical interconnects or microoptics to couple, for example chip-to-chip or dies to fiber, with passive alignment only. Flexible exposure strategies using High Precision 3D Printing provide both, scalability and high throughput with fabrication times from seconds for optical waveguides and single microlenses to only a few minutes for more complex lens systems. The impact of the fabrication strategy will be discussed with respect to the performance of the optical devices.

Paper Details

Date Published: 19 March 2018
Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058614 (19 March 2018); doi: 10.1117/12.2297404
Show Author Affiliations
Benedikt Stender, Multiphoton Optics GmbH (Germany)
Willi Mantei, Multiphoton Optics GmbH (Germany)
Alexander Krupp, Multiphoton Optics GmbH (Germany)
Valentin Ratz, Multiphoton Optics GmbH (Germany)
Fabian Hilbert, Multiphoton Optics GmbH (Germany)
Ruth Houbertz, Multiphoton Optics GmbH (Germany)

Published in SPIE Proceedings Vol. 10586:
Advances in Patterning Materials and Processes XXXV
Christoph K. Hohle, Editor(s)

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