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Cross-platform (NXE-NXT) machine-to-machine overlay matching supporting next node chip manufacturing
Author(s): Theo Thijssen; Marcel Beckers; Albert Mollema; Leon Levasier; Alexander Padi; Chia-Wei Hung; Hsiao-Lan Chen; Laurens van Bokhoven; Niels Lammers; Jean Phillippe van Damme; Floris Teeuwisse; Robin Tijssen; Wilson Tzeng; Cathy Wang; Marcel Mastenbroek; Harald Vos; Ting-Ju Yueh; Miao-Chi Chen ; Hsueh-Hung Wu; Shin-Rung Peng; Chun-Kuang Chen; L. J. Chen ; Kevin Cheng; John Lin
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Paper Abstract

EUV lithography enables the transition from multiple patterning in DUV back to single patterning in EUV, with the associated cost benefit. While imaging and patterning becomes easier with EUV, cross-platform overlay performance needs to be taken into account.

With quadruple patterning, the matching performance is driven by the platform capabilities, with platform specific fingerprints not contributing to the matching performance as they are similar for each layer. Introducing EUV automatically means we need to compensate for the differences in the platform fingerprints, as they bring a penalty in the DUV-EUV matching budget.

This paper will explain what the main overlay contributors in cross-platform matched machine overlay are and how they can be cancelled or reduced using additional correction measures, with the goal to reach below 2.0 nm cross matched machine overlay.

Paper Details

Date Published: 20 March 2018
PDF: 8 pages
Proc. SPIE 10587, Optical Microlithography XXXI, 1058709 (20 March 2018); doi: 10.1117/12.2297387
Show Author Affiliations
Theo Thijssen, ASML Netherlands B.V. (Netherlands)
Marcel Beckers, ASML Netherlands B.V. (Netherlands)
Albert Mollema, ASML Netherlands B.V. (Netherlands)
Leon Levasier, ASML Netherlands B.V. (Netherlands)
Alexander Padi, ASML Netherlands B.V. (Netherlands)
Chia-Wei Hung, ASML Netherlands B.V. (Netherlands)
Hsiao-Lan Chen, ASML Netherlands B.V. (Netherlands)
Laurens van Bokhoven, ASML Netherlands B.V. (Netherlands)
Niels Lammers, ASML Netherlands B.V. (Netherlands)
Jean Phillippe van Damme, ASML Netherlands B.V. (Netherlands)
Floris Teeuwisse, ASML Netherlands B.V. (Netherlands)
Robin Tijssen, ASML Netherlands B.V. (Netherlands)
Wilson Tzeng, ASML Netherlands B.V. (Netherlands)
Cathy Wang, ASML Netherlands B.V. (Netherlands)
Marcel Mastenbroek, ASML Netherlands B.V. (Netherlands)
Harald Vos, ASML Netherlands B.V. (Netherlands)
Ting-Ju Yueh, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Miao-Chi Chen , Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Hsueh-Hung Wu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Shin-Rung Peng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Chun-Kuang Chen, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
L. J. Chen , Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Kevin Cheng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
John Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)


Published in SPIE Proceedings Vol. 10587:
Optical Microlithography XXXI
Jongwook Kye, Editor(s)

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