Share Email Print

Proceedings Paper

The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The progress of using DSA for metal cut to achieve sub-20nm tip-to-tip (t2t) critical dimension (CD) is reported. Small and uniform t2t CD is very challenging due to lithographic limitation but holds the key to backend-of-the-line (BEOL) scaling. An integration scheme is demonstrated that allows the combination of design flexibility and fine, rectified local CD uniformity (LCDU). The combined effect of LCDU and centroid jittering will be discussed and compared to a hole shrink process using atomic layer deposition and spacer formation. The learning from this case study can provide perspectives that may not have been investigated thoroughly in the past. By including more important elements during DSA process development, such as metal cut, the DSA maturit y can be further advanced and move DSA closer to HVM adoption.

Paper Details

Date Published: 28 March 2018
PDF: 9 pages
Proc. SPIE 10584, Novel Patterning Technologies 2018, 105840L (28 March 2018); doi: 10.1117/12.2297365
Show Author Affiliations
Chi-Chun Liu, IBM Corp. (United States)
Yann Mignot, IBM Corp. (United States)
Cheng Chi, IBM Corp. (United States)
Richard Farrell, TEL Technology Ctr., America, LLC (United States)
Kafai Lai, IBM Thomas J. Watson Research Ctr. (United States)
Jing Guo, IBM Corp. (United States)
Jing Sha, IBM Thomas J. Watson Research Ctr. (United States)
Martin Glodde, IBM Thomas J. Watson Research Ctr. (United States)
Makoto Muramatsu, Tokyo Electron Kyushu Ltd. (Japan)
Yasuyuki Ido, Tokyo Electron Kyushu Ltd. (Japan)
Nelson Felix, IBM Corp. (United States)
David Hetzer, TEL Technology Ctr., America, LLC (United States)
Andrew Metz, TEL Technology Ctr., America, LLC (United States)
Daniel Corliss, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 10584:
Novel Patterning Technologies 2018
Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top