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Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
Author(s): Sohan Singh Mehta; Marco Yeung; Fahad Mirza; Thiagarajan Raman; Travis Longenbach; Justin Morgan; Mark Duggan; Rio A. Soedibyo; Sean Reidy; Mohamed Rabie; Jae Kyu Cho; C. S. Premachandran; Danish Faruqui
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Paper Abstract

In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate ~45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.

Paper Details

Date Published: 13 March 2018
PDF: 13 pages
Proc. SPIE 10586, Advances in Patterning Materials and Processes XXXV, 1058612 (13 March 2018); doi: 10.1117/12.2297360
Show Author Affiliations
Sohan Singh Mehta, GLOBALFOUNDRIES Inc. (United States)
Marco Yeung, GLOBALFOUNDRIES Inc. (United States)
Fahad Mirza, GLOBALFOUNDRIES Inc. (United States)
Thiagarajan Raman, GLOBALFOUNDRIES Inc. (United States)
Travis Longenbach, GLOBALFOUNDRIES Inc. (United States)
Justin Morgan, GLOBALFOUNDRIES Inc. (United States)
Mark Duggan, GLOBALFOUNDRIES Inc. (United States)
Rio A. Soedibyo, GLOBALFOUNDRIES Inc. (United States)
Sean Reidy, GLOBALFOUNDRIES Inc. (United States)
Mohamed Rabie, GLOBALFOUNDRIES Inc. (United States)
Jae Kyu Cho, GLOBALFOUNDRIES Inc. (United States)
C. S. Premachandran, GLOBALFOUNDRIES Inc. (United States)
Danish Faruqui, GLOBALFOUNDRIES Inc. (United States)


Published in SPIE Proceedings Vol. 10586:
Advances in Patterning Materials and Processes XXXV
Christoph K. Hohle, Editor(s)

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