Share Email Print
cover

Proceedings Paper • new

A new way of measuring wiggling pattern in SADP for 3D NAND technology
Author(s): Jian Mi; Ziqi Chen; Li Ming Tu; Xiaoming Mao; Gong Cai Liu; Hiroki Kawada
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A new metrology method of quantitatively measuring wiggling patterns in a Self-Aligned Double Patterning (SADP) process for 2D NAND technology has been developed with a CD-SEM metrology program on images from a Review-SEM system. The metrology program provided accurate modeling of various wiggling patterns. The Review-SEM system provided a-few-micrometer-wide Field of View (FOV), which exceeds precision-guaranteed FOV of a conventional CD-SEM. The result has been effectively verified by visual inspection on vertically compressed images compared with Wiggling Index from this new method. A best-known method (BKM) system has been developed with connected HW and SW to automatically measure wiggling patterns.

Paper Details

Date Published: 13 March 2018
PDF: 6 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105852S (13 March 2018); doi: 10.1117/12.2297249
Show Author Affiliations
Jian Mi, Yangtze Memory Technologies Co., Ltd. (China)
Ziqi Chen, Yangtze Memory Technologies Co., Ltd. (China)
Li Ming Tu, Yangtze Memory Technologies Co., Ltd. (China)
Xiaoming Mao, Yangtze Memory Technologies Co., Ltd. (China)
Gong Cai Liu, Yangtze Memory Technologies Co., Ltd. (China)
Hiroki Kawada, Hitachi High-Technologies Corp. (Japan)


Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

© SPIE. Terms of Use
Back to Top