Share Email Print
cover

Proceedings Paper

Matching between simulations and measurements as a key driver for reliable overlay target design
Author(s): S. Lozenko; T. Shapoval; G. Ben-Dov; Z. Lindenfeld; B. Schulz ; L. Fuerst; C. Hartig; R. Haupt; M. Ruhm; R. Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Numerical simulation of overlay metrology targets has become a de-facto standard in advanced technology nodes. While appropriate simulation software is widely available in the industry alongside with metrics that allow selection of the best performing targets, the model validation tools are less developed. We present an approach of numerical model validation based on the comparison between target simulation results and on-product overlay measurements. A “simulation-tomeasurement” software is used in this work to compare the performance metrics and accuracy flags of scatterometrybased overlay targets designed using KLA-Tencor AcuRate™ simulator for the critical layers of 12nm FD-SOI FEOL stack and 22nm FD-SOI BEOL stack. We demonstrate how simulation-to-measurement matching enabled us to verify the model, identify discrepancies between the model and the product stack and build an improved model that correctly describes the target. The refined target stack was used for image-based overlay target simulations that allowed us to obtain better performing optical overlay targets as well.

Paper Details

Date Published: 13 March 2018
PDF: 12 pages
Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 105851E (13 March 2018); doi: 10.1117/12.2297011
Show Author Affiliations
S. Lozenko, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
T. Shapoval, KLA-Tencor GmbH (Germany)
G. Ben-Dov, KLA-Tencor Israel (Israel)
Z. Lindenfeld, KLA-Tencor Israel (Israel)
B. Schulz , GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
L. Fuerst, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
C. Hartig, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
R. Haupt, KLA-Tencor GmbH (Germany)
M. Ruhm, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany)
R. Wang, KLA-Tencor China (China)


Published in SPIE Proceedings Vol. 10585:
Metrology, Inspection, and Process Control for Microlithography XXXII
Vladimir A. Ukraintsev, Editor(s)

© SPIE. Terms of Use
Back to Top