Share Email Print
cover

Proceedings Paper • new

Capacitance-based wireless strain sensor development
Author(s): Jong-Hyun Jeong; Jian Xu; Hongki Jo; Jian Li; Xiangxiong Kong; William Collins; Caroline Bennett; Simon Laflamme
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A capacitance based large-area electronics strain sensor, termed soft elastomeric capacitor (SEC) has shown various advantages in infrastructure sensing. The ability to cover large area enables to reflect mesoscale structural deformation, highly stretchable, easy to fabricate and low-cost feature allow full-scale field application for civil structure. As continuing efforts to realize full-scale civil infrastructure monitoring, in this study, new sensor board has been developed to implement the capacitive strain sensing capability into wireless sensor networks. The SEC has extremely low-level capacitance changes as responses to structural deformation; hence it requires high-gain and low-noise performance. For these requirements, AC (alternating current) based Wheatstone bridge circuit has been developed in combination a bridge balancer, two-step amplifiers, AM-demodulation, and series of filtering circuits to convert low-level capacitance changes to readable analog voltages. The new sensor board has been designed to work with the wireless platform that uses Illinois Structural Health Monitoring Project (ISHMP) wireless sensing software Toolsuite and allow 16bit lownoise data acquisition. The performances of new wireless capacitive strain sensor have been validated series of laboratory calibration tests. An example application for fatigue crack monitoring is also presented.

Paper Details

Date Published: 27 March 2018
PDF: 7 pages
Proc. SPIE 10598, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018, 105980S (27 March 2018); doi: 10.1117/12.2296716
Show Author Affiliations
Jong-Hyun Jeong, The Univ. of Arizona (United States)
Jian Xu, Wuhan Polytechnic Univ. (China)
Hongki Jo, The Univ. of Arizona (United States)
Jian Li, The Univ. of Kansas (United States)
Xiangxiong Kong, The Univ. of Kansas (United States)
William Collins, The Univ. of Kansas (United States)
Caroline Bennett, The Univ. of Kansas (United States)
Simon Laflamme, Iowa State Univ. (United States)


Published in SPIE Proceedings Vol. 10598:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018
Hoon Sohn, Editor(s)

© SPIE. Terms of Use
Back to Top