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Proceedings Paper

Thick-film resistors on glass ceramic substrates as smart strain sensing aggregates for SHM
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Paper Abstract

Thick film resistors (TFRs) were screen-printed and fired on fluorophlogopite glass ceramic (FGC) and alumina ceramic substrate as smart aggregates. Performances of smart aggregates under compressive load were tested before and after embedded in mortar specimens. Compared to alumina ceramic substrate, the TFRs on FGC shows better compatibility and matching performance, the matching error between sensor and mortar decreased from 0.734 to 0.187, the output strain ratio between sensor and mortar increased from 0.0837 to 0.421, and the test results confirmed the theoretical calculation results. When embedded in mortar, the TFRs on FGC shows better repeatability than that on alumina ceramic under repeated compressive load.

Paper Details

Date Published: 27 March 2018
PDF: 8 pages
Proc. SPIE 10598, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018, 105981C (27 March 2018); doi: 10.1117/12.2296446
Show Author Affiliations
Xinchun Guan, Harbin Institute of Technology (China)
Ming Wen, Harbin Institute of Technology (China)
Hui Li, Harbin Institute of Technology (China)
Jinping Ou, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 10598:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018
Hoon Sohn, Editor(s)

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