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Proceedings Paper

Holographic interferometry in predicting cathodic deposition of metals in aqueous solution
Author(s): K. Habib
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Paper Abstract

A mathematical model relating surface and bulk behaviors of metals in aqueous solution has been developed. The model was established based on principles of Holographic interferometry for measuring microsurface deposition, i.e., mass gain, and with those of electrochemistry for measuring the bulk electronic current, i.e., electroplating current. The model can be utilized to predict the electroplating behavior on metals subjected to cathodic reaction in aqueous solution. In other words, the cathodic current density of metals can be predicted as a function of microsurface deposition.

Paper Details

Date Published: 1 July 1990
PDF: 4 pages
Proc. SPIE 1230, International Conference on Optoelectronic Science and Engineering '90, 12302Z (1 July 1990); doi: 10.1117/12.2294744
Show Author Affiliations
K. Habib, Kuwait Institute for Scientific Research (Kuwait)


Published in SPIE Proceedings Vol. 1230:
International Conference on Optoelectronic Science and Engineering '90
DaHeng Wang, Editor(s)

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