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Proceedings Paper

Potential of LIGA technology for optoelectronic interconnects
Author(s): W. Bacher; Peter Bley; Herbert O. Moser
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Paper Abstract

LIGA is a fabrication technology suitable for mass producing high aspect-ratio microstructured components with nearly arbitrary 3D shapes in almost any material. The acronym stems from the German words for lithography, electroforming, and plastic molding. Fabricating highly parallel microoptical systems either for guided-wave or for free-space light transmission by LIGA technology may turn out to be a cost-effective way to satisfy optical interconnect demands.

Paper Details

Date Published: 30 January 1996
PDF: 19 pages
Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840R (30 January 1996); doi: 10.1117/12.229277
Show Author Affiliations
W. Bacher, Forschungszentrum Karlsruhe GmbH (Germany)
Peter Bley, Forschungszentrum Karlsruhe GmbH (Germany)
Herbert O. Moser, Forschungszentrum Karlsruhe GmbH (Germany)


Published in SPIE Proceedings Vol. 10284:
Optoelectronic Interconnects and Packaging: A Critical Review
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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