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Proceedings Paper

Polymer optical interconnect technology (POINT): optoelectronic packaging and interconnect for board and backplane applications
Author(s): Y. S. Liu; R. J. Wojnarowski; W. B. Hennessy; Julian P. G. Bristow; Yue Liu; Andrzej Peczalski; John R. Rowlette; Alan Plotts; Jared D. Stack; James T. Yardley; Louay A. Eldada; Richard M. Osgood; Robert Scarmozzino; Sing H. Lee; Volkan H. Ozguz
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Paper Abstract

The Polymer Optical Interconnect Technology (POINT) represents a major collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and the University of California at San Diego (UCSD), sponsored by ARPA, in developing affordable optoelectronic module packaging and interconnect technologies for board- and backplane- level optical interconnect applications for a wide range of military and commercial applications. The POINT program takes a novel development approach by fully leveraging the existing electronic design, processing, fabrication and module packaging technologies to optoelectronic module packaging. The POINT program further incorporates several state-of-the-art optoelectronic technologies that include high-speed VCSEL for multichannel array data TM transmission; flexible optical polymers such as Polyguide or coupling of device-to-fiber using a passively alignment process; a low-loss polymer for backplane interconnect to provide a high I/O density; low-cost diffractive optical elements (DOE) for board-to-backplane interconnect; and use of molded MT array ferrule to reduce overall system size, weight, and cost. In addition to further reducing design and fabrication cycle times, computer simulation tools for optical waveguide and mechanical modeling will be advanced under the POINT program.

Paper Details

Date Published: 30 January 1996
PDF: 10 pages
Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840N (30 January 1996); doi: 10.1117/12.229274
Show Author Affiliations
Y. S. Liu, GE Corporate Research and Development Ctr. (United States)
R. J. Wojnarowski, GE Corporate Research and Development Ctr. (United States)
W. B. Hennessy, GE Corporate Research and Development Ctr. (United States)
Julian P. G. Bristow, Honeywell Technology Ctr. (United States)
Yue Liu, Honeywell Technology Ctr. (United States)
Andrzej Peczalski, Honeywell Technology Ctr. (United States)
John R. Rowlette, AMP, Inc. (United States)
Alan Plotts, AMP, Inc. (United States)
Jared D. Stack, AMP, Inc. (United States)
James T. Yardley, AlliedSignal Inc. (United States)
Louay A. Eldada, AlliedSignal Inc. (United States)
Richard M. Osgood, Columbia Univ. (United States)
Robert Scarmozzino, Columbia Univ. (United States)
Sing H. Lee, Univ. of California, San Diego (United States)
Volkan H. Ozguz, Univ. of California, San Diego (United States)


Published in SPIE Proceedings Vol. 10284:
Optoelectronic Interconnects and Packaging: A Critical Review
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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