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Proceedings Paper

Intracomputer optical interconnects: progress and challenges
Author(s): Julian Bristow
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Paper Abstract

Several interconnect Junctions within cabinets comprising high performance computers are pushing the limits of electrical interconnect technology. A widespread problem of limited interconnect density at the board-to-backplane interface has been identified, while advances in clock speed and cabinet functionality are expected to stress electrical interconnects first for high fanout applications, then for high speed point-to-point parallel interconnects. Key components are described, and from these components the design of a generic optical backplane technology is described. While components are now available to implement a practical solution, the use of proven electrical techniques is considered an important step in hastening the introduction of the technology.

Paper Details

Date Published: 30 January 1996
PDF: 9 pages
Proc. SPIE 10284, Optoelectronic Interconnects and Packaging: A Critical Review, 102840H (30 January 1996); doi: 10.1117/12.229268
Show Author Affiliations
Julian Bristow, Honeywell Technology Ctr. (United States)


Published in SPIE Proceedings Vol. 10284:
Optoelectronic Interconnects and Packaging: A Critical Review
Ray T. Chen; Peter S. Guilfoyle, Editor(s)

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