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Proceedings Paper

Low-profile fiber connector for co-packaged optics
Author(s): Lars Brusberg; Michael DeJong; Douglas L. Butler; Jeffrey S. Clark; Clifford G. Sutton
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Paper Abstract

We developed a small form factor connector that can be assembled on all four sides of a high-data switch package for fiber connectivity. This paper discusses a novel connector approach that has the potential to meet all co-packaging requirements including solder-reflow-compatibility, de-mateability, low insertion loss and state-of-the art FAU attach. The connector was attached to the PIC for performance evaluation. The average insertion loss across all eight fibers of the assembly was 1.77 dB, including the three optical interfaces: (1) MT-to-MT between connector and receptacle, (2) receptacle-to-PLC and (3) PIC-to-FAU. Also included is the propagation loss of the PIC waveguide. Optical return loss was measured to be -55 dB or lower.

Paper Details

Date Published: 22 February 2018
PDF: 6 pages
Proc. SPIE 10538, Optical Interconnects XVIII, 105380S (22 February 2018); doi: 10.1117/12.2292086
Show Author Affiliations
Lars Brusberg, Corning Research and Development Cooperation (United States)
Michael DeJong, Corning Optical Communications LLC (United States)
Douglas L. Butler, Corning Research and Development Cooperation (United States)
Jeffrey S. Clark, Corning Research and Development Cooperation (United States)
Clifford G. Sutton, Corning Research and Development Cooperation (United States)

Published in SPIE Proceedings Vol. 10538:
Optical Interconnects XVIII
Henning Schröder; Ray T. Chen, Editor(s)

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