Share Email Print
cover

Proceedings Paper

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
Author(s): Alexander Janta-Polczynski; Elaine Cyr; Jerome Bougie; Alain Drouin; Richard Langlois; Darrell Childers; Shotaro Takenobu; Yoichi Taira; Ted Lichoulas; Swetha Kamlapurkar; Sebastian Engelmann; Paul P. Fortier; Nicolas Boyer; Tymon Barwicz
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Details

Date Published:
PDF
Proc. SPIE 10538, Optical Interconnects XVIII, ; doi: 10.1117/12.2291902
Show Author Affiliations
Alexander Janta-Polczynski, IBM Canada Ltd. (Canada)
Elaine Cyr, IBM Canada Ltd. (Canada)
Jerome Bougie, IBM Canada Ltd. (Canada)
Alain Drouin, IBM Canada Ltd (Canada)
Richard Langlois, IBM Canada Ltd. (Canada)
Darrell Childers, US Conec Ltd. (United States)
Shotaro Takenobu, Asahi Glass Co., Ltd. (Japan)
Yoichi Taira, IBM Research - Tokyo (Japan)
Ted Lichoulas, AFL (United States)
Swetha Kamlapurkar, IBM Thomas J. Watson Research Ctr. (United States)
Sebastian Engelmann, IBM Thomas J. Watson Research Ctr. (United States)
Paul P. Fortier, IBM Canada Ltd. (Canada)
Nicolas Boyer, IBM Canada Ltd. (Canada)
Tymon Barwicz, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 10538:
Optical Interconnects XVIII
Henning Schröder; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top