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A fiber optic temperature sensor based on multi-core microstructured fiber with coupled cores for a high temperature environment
Author(s): A. Makowska; K. Markiewicz; L. Szostkiewicz; A. Kolakowska; J. Fidelus; T. Stanczyk; K. Wysokinski; D. Budnicki; L. Ostrowski; M. Szymanski; M. Makara; K. Poturaj; T. Tenderenda; P. Mergo; T. Nasilowski
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Paper Abstract

Sensors based on fiber optics are irreplaceable wherever immunity to strong electro-magnetic fields or safe operation in explosive atmospheres is needed. Furthermore, it is often essential to be able to monitor high temperatures of over 500°C in such environments (e.g. in cooling systems or equipment monitoring in power plants). In order to meet this demand, we have designed and manufactured a fiber optic sensor with which temperatures up to 900°C can be measured. The sensor utilizes multi-core fibers which are recognized as the dedicated medium for telecommunication or shape sensing, but as we show may be also deployed advantageously in new types of fiber optic temperature sensors. The sensor presented in this paper is based on a dual-core microstructured fiber Michelson interferometer. The fiber is characterized by strongly coupled cores, hence it acts as an all-fiber coupler, but with an outer diameter significantly wider than a standard fused biconical taper coupler, which significantly increases the coupling region’s mechanical reliability. Owing to the proposed interferometer imbalance, effective operation and high-sensitivity can be achieved. The presented sensor is designed to be used at high temperatures as a result of the developed low temperature chemical process of metal (copper or gold) coating. The hermetic metal coating can be applied directly to the silica cladding of the fiber or the fiber component. This operation significantly reduces the degradation of sensors due to hydrolysis in uncontrolled atmospheres and high temperatures.

Paper Details

Date Published: 23 February 2018
PDF: 7 pages
Proc. SPIE 10526, Physics and Simulation of Optoelectronic Devices XXVI, 105260X (23 February 2018); doi: 10.1117/12.2290780
Show Author Affiliations
A. Makowska, InPhoTech (Poland)
Warsaw Univ. of Technology (Poland)
K. Markiewicz, InPhoTech (Poland)
L. Szostkiewicz, InPhoTech (Poland)
Warsaw Univ. of Technology (Poland)
A. Kolakowska, InPhoTech (Poland)
J. Fidelus, InPhoTech (Poland)
T. Stanczyk, IPT Applied (Poland)
K. Wysokinski, Polish Ctr. for Photonics and Fibre Optics (Poland)
D. Budnicki, InPhoTech (Poland)
L. Ostrowski, InPhoTech (Poland)
M. Szymanski, Polish Ctr. For Photonics and Fibre Optics (Poland)
M. Makara, InPhoTech (Poland)
K. Poturaj, Univ. of Maria Curie-Sklodowska (Poland)
T. Tenderenda, Polish Ctr. for Photonics and Fibre Optics (Poland)
P. Mergo, Univ. of Maria Curie-Sklodowska (Poland)
T. Nasilowski, InPhoTech (Poland)

Published in SPIE Proceedings Vol. 10526:
Physics and Simulation of Optoelectronic Devices XXVI
Bernd Witzigmann; Marek Osiński; Yasuhiko Arakawa, Editor(s)

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