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Proceedings Paper

Virtual prototyping of complex photonic components and integrated circuits for polymer-based integration platform
Author(s): A. Polatynski; D. de Felipe; H. Conradi; M. Kresse; A. Richter; S. Mingaleev; E. Sokolov; M. Kleinert; C. Zawadzki; N. Keil
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Paper Abstract

Recent developments in versatile polymer-based technologies and hybrid integration processes offer a flexible and cost-efficient alternative for creating very complex photonic components and integrated circuits. The fast and efficient test, optimization and verification of new ideas requires an automated and reproducible simulation and design process supporting flexible layout-driven and layout-aware schematic-driven methodologies. Targeting very complex designs, even small fabrication tolerances of one building block could make a huge difference on the performance and manufacturability of the whole structure. To reduce risk of failure and to make performance predictions by virtual prototyping reliable, the simulation model of each single building block needs to be working correctly based not only on the appropriate mathematical and physical equations, but also on adequate information provided by the foundry where the final structure will be manufactured.

The PolyPhotonics Berlin consortium targets to address these design challenges and establish a new versatile integration platform combining polymer with Indium-Phosphide and thin-film filter based technologies for numerous photonics applications in the global communications and sensing market. In this paper we will present our methodologies for modelling and prototyping optical elements including hybrid coupling techniques, and compare them with exemplary characterization data obtained from measurements of fabricated devices and test structures. We will demonstrate how the seamless integration between photonic circuit and foundry knowledge enable the rapid virtual prototyping of complex photonic components and integrated circuits.

Paper Details

Date Published: 22 February 2018
PDF: 8 pages
Proc. SPIE 10536, Smart Photonic and Optoelectronic Integrated Circuits XX, 1053624 (22 February 2018); doi: 10.1117/12.2290436
Show Author Affiliations
A. Polatynski, VPIphotonics GmbH (Germany)
D. de Felipe, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
H. Conradi, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
M. Kresse, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
A. Richter, VPIphotonics GmbH (Germany)
S. Mingaleev, VPI Development Ctr. (Belarus)
E. Sokolov, VPIphotonics (United States)
M. Kleinert, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
C. Zawadzki, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)
N. Keil, Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut (Germany)

Published in SPIE Proceedings Vol. 10536:
Smart Photonic and Optoelectronic Integrated Circuits XX
Sailing He; El-Hang Lee, Editor(s)

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