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Breaking the mold of photonic packaging
Author(s): Tymon Barwicz; Ted W. Lichoulas; Yoichi Taira; Yves Martin; Shotaro Takenobu; Alexander Janta-Polczynski; Hidetoshi Numata; Eddie L. Kimbrell; Jae-Woong Nah; Bo Peng; Darrell Childers; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Elaine Cyr; Sebastian Engelmann; Paul Fortier; Nicolas Boyer
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Paper Abstract

The packaging of photonic devices remains a hindering challenge to the deployment of integrated photonic modules. This is never as true as for silicon photonic modules where the cost efficiency and scalability of chip fabrication in microelectronic production facilities is far ahead of current photonic packaging technology. More often than not, photonic modules are still packaged today with legacy manual processes and high-precision active alignment. Automation of these manual processes can provide gains in yield and scalability. Thus, specialized automated equipment has been developed for photonic packaging, is now commercially available, and is providing an incremental improvement in cost and scalability. However, to bring the cost and scalability of photonic packaging on par with silicon chip fabrication, we feel a more disruptive approach is required. Hence, in recent years, we have developed photonic packaging in standard, highthroughput microelectronic packaging facilities. This approach relies on the concepts already responsible for the attractiveness of silicon photonic chip fabrication: (1) moving complexity from die-level packaging processes to waferlevel planar fabrication, and (2) leveraging the scale of existing microelectronic facilities for photonic fabrication. We have demonstrated such direction with peak coupling performance of 1.3 dB from standard cleaved fiber to chip and 1.1 dB from chip to chip.

Paper Details

Date Published: 23 February 2018
PDF: 11 pages
Proc. SPIE 10535, Integrated Optics: Devices, Materials, and Technologies XXII, 105350R (23 February 2018); doi: 10.1117/12.2290230
Show Author Affiliations
Tymon Barwicz, IBM Thomas J. Watson Research Ctr. (United States)
Ted W. Lichoulas, AFL Telecommunications (United States)
Yoichi Taira, IBM Thomas J. Watson Research Ctr. (United States)
Yves Martin, IBM Thomas J. Watson Research Ctr. (United States)
Shotaro Takenobu, Asahi Glass Co. (Japan)
Alexander Janta-Polczynski, IBM Bromont (Canada)
Hidetoshi Numata, IBM Research - Tokyo (Japan)
Eddie L. Kimbrell, AFL Telecommunications (United States)
Jae-Woong Nah, IBM Thomas J. Watson Research Ctr. (United States)
Bo Peng, IBM Thomas J. Watson Research Ctr. (United States)
Darrell Childers, US Conec Ltd. (United States)
Robert Leidy, Global Foundries (United States)
Marwan Khater, IBM Thomas J. Watson Research Ctr. (United States)
Swetha Kamlapurkar, IBM Thomas J. Watson Research Ctr. (United States)
Elaine Cyr, IBM Bromont (Canada)
Sebastian Engelmann, IBM Thomas J. Watson Research Ctr. (United States)
Paul Fortier, IBM Bromont (Canada)
Nicolas Boyer, IBM Bromont (Canada)


Published in SPIE Proceedings Vol. 10535:
Integrated Optics: Devices, Materials, and Technologies XXII
Sonia M. García-Blanco; Pavel Cheben, Editor(s)

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