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Proceedings Paper • new

Universal test system for system embedded optical interconnect
Author(s): R. Pitwon; K. Wang; M. Immonen; H. Schröder; M. Neitz
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Paper Abstract

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Paper Details

Date Published: 22 February 2018
PDF: 10 pages
Proc. SPIE 10538, Optical Interconnects XVIII, 1053804 (22 February 2018); doi: 10.1117/12.2289590
Show Author Affiliations
R. Pitwon, Seagate (United Kingdom)
K. Wang, Seagate (United Kingdom)
M. Immonen, TTM Technologies (Finland)
H. Schröder, Fraunhofer Institute for Reliability and Microintegration (Germany)
M. Neitz, Fraunhofer Institute for Reliability and Microintegration (Germany)


Published in SPIE Proceedings Vol. 10538:
Optical Interconnects XVIII
Henning Schröder; Ray T. Chen, Editor(s)

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