Share Email Print
cover

Proceedings Paper • new

Reverse layered transfer technology as an innovative manufacturing process for high-efficiency OLED lightings (Conference Presentation)
Author(s): Yonung Yoo; Yoonsoo Choi; Yeong Jin Lim; Jin-Young Na; Sun-Kyung Kim; Jae-Ho Kim; Tae-Yeon Seong
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

OLED lightings are getting more attention from industry since characteristic of surface lighting gives design flexibility and energy saving. Transparent conductive electrodes (TCEs) and internal out-coupling layer are essential components to determine OLED performance. Typical out-coupling layer is combination of scattering structure and planarizing layer. ~m planarizing layer smooths rough topology causing from the scattering structure so that sufficiently flat TCE can be coated on it. However undesirable gap between the TCE and the scattering structure occurs inevitably by the insertion of ~m planarizing layer. This leads to diminish out-coupling effect because the scattering structure is located optically too far from TCE to reduce wave guiding loss around TCE. Thus, it is important to bring the scattering structure close to TCE so as to reduce the wave guiding loss around TCE. Here, we present an innovative manufacturing process named “Reverse Layered Transfer process” that makes TCE directly contact with scattering structure, resulting in high out-coupling efficacy. The flexible OLED applied with Reverse Layered Transfer showed 1.8 times higher luminous efficacy than a rigid OLED based on normal process using ref ITO TCE. TCE integrated with out-coupling layer using “Reverse Layered Transfer process” and its device property will be described, together with experimental results and theoretical explanation.

Paper Details

Date Published: 14 March 2018
PDF
Proc. SPIE 10541, Photonic and Phononic Properties of Engineered Nanostructures VIII, 1054108 (14 March 2018); doi: 10.1117/12.2289497
Show Author Affiliations
Yonung Yoo, Duksan Hi-Metal Co., Ltd. (Korea, Republic of)
Yoonsoo Choi, Duksan Hi-Metal Co., Ltd. (Korea, Republic of)
Yeong Jin Lim, Duksan Hi-Metal Co., Ltd. (Korea, Republic of)
Jin-Young Na, Kyung Hee Univ. (Korea, Democratic Peoples Republic of)
Sun-Kyung Kim, Kyung Hee Univ. (Korea, Republic of)
Jae-Ho Kim, Korea Univ. (Korea, Republic of)
Tae-Yeon Seong, Korea Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10541:
Photonic and Phononic Properties of Engineered Nanostructures VIII
Ali Adibi; Shawn-Yu Lin; Axel Scherer, Editor(s)

© SPIE. Terms of Use
Back to Top