Share Email Print
cover

Proceedings Paper

Flip-chip optical fiber attachment to a monolithic optical receiver chip
Author(s): Vijayanand Vusirikala; Peter J.S. Heim; Mario Dagenais; C. Philip McClay
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.

Paper Details

Date Published: 27 December 1995
PDF: 7 pages
Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995); doi: 10.1117/12.228877
Show Author Affiliations
Vijayanand Vusirikala, Univ. of Maryland/College Park (United States)
Peter J.S. Heim, Univ. of Maryland/College Park (United States)
Mario Dagenais, Univ. of Maryland/College Park (United States)
C. Philip McClay, MITRE Corp. (United States)


Published in SPIE Proceedings Vol. 2613:
Emerging Components and Technologies for All-Optical Networks
Emil S. Koteles; Alan Eli Willner, Editor(s)

© SPIE. Terms of Use
Back to Top