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Proceedings Paper

Flip-chip optical fiber attachment to a monolithic optical receiver chip
Author(s): Vijayanand Vusirikala; Peter J.S. Heim; Mario Dagenais; C. Philip McClay
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Paper Abstract

We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.

Paper Details

Date Published: 27 December 1995
PDF: 7 pages
Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995); doi: 10.1117/12.228877
Show Author Affiliations
Vijayanand Vusirikala, Univ. of Maryland/College Park (United States)
Peter J.S. Heim, Univ. of Maryland/College Park (United States)
Mario Dagenais, Univ. of Maryland/College Park (United States)
C. Philip McClay, MITRE Corp. (United States)

Published in SPIE Proceedings Vol. 2613:
Emerging Components and Technologies for All-Optical Networks
Emil S. Koteles; Alan Eli Willner, Editor(s)

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