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Parallel processing of embossing dies with ultrafast lasers
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Paper Abstract

Functionalization of surfaces equips products and components with new features like hydrophilic behavior, adjustable gloss level, light management properties, etc. Small feature sizes demand diffraction-limited spots and adapted fluence for different materials. Through the availability of high power fast repeating ultrashort pulsed lasers and efficient optical processing heads delivering diffraction-limited small spot size of around 10μm it is feasible to achieve fluences higher than an adequate patterning requires. Hence, parallel processing is becoming of interest to increase the throughput and allow mass production of micro machined surfaces.

The first step on the roadmap of parallel processing for cylinder embossing dies was realized with an eight- spot processing head based on ns-fiber laser with passive optical beam splitting, individual spot switching by acousto optical modulation and an advanced imaging. Patterning of cylindrical embossing dies shows a high efficiency of nearby 80%, diffraction-limited and equally spaced spots with pitches down to 25μm achieved by a compression using cascaded prism arrays. Due to the nanoseconds laser pulses the ablation shows the typical surrounding material deposition of a hot process.

In the next step the processing head was adapted to a picosecond-laser source and the 500W fiber laser was replaced by an ultrashort pulsed laser with 300W, 12ps and a repetition frequency of up to 6MHz. This paper presents details about the processing head design and the analysis of ablation rates and patterns on steel, copper and brass dies. Furthermore, it gives an outlook on scaling the parallel processing head from eight to 16 individually switched beamlets to increase processing throughput and optimized utilization of the available ultrashort pulsed laser energy.

Paper Details

Date Published: 19 February 2018
PDF: 10 pages
Proc. SPIE 10520, Laser-based Micro- and Nanoprocessing XII, 105200I (19 February 2018); doi: 10.1117/12.2288278
Show Author Affiliations
Manfred Jarczynski, LIMO Lissotschenko Mikrooptik GmbH (Germany)
Thomas Mitra, LIMO Lissotschenko Mikrooptik GmbH (Germany)
Stephan Brüning, Schepers GmbH & Co. KG (Germany)
Keming Du, EdgeWave GmbH (Germany)
Gerald Jenke, Saueressig GmbH + Co. KG (Germany)


Published in SPIE Proceedings Vol. 10520:
Laser-based Micro- and Nanoprocessing XII
Udo Klotzbach; Kunihiko Washio; Rainer Kling, Editor(s)

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