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An introduction of resistive arrays and packaging technology
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Paper Abstract

As an important way to simulate the dynamic infrared scene, the technology of resistive arrays, especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors, a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters, such as temperature, frame rate, uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition, development and current situation of the packaging technology is discussed and analyzed in this paper. At last, the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided.

Paper Details

Date Published: 24 October 2017
PDF: 6 pages
Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104624G (24 October 2017); doi: 10.1117/12.2285546
Show Author Affiliations
Quan Sun, Shanghai Institute of Technical Physics of the Chinese Academy of Sciences (China)
Univ. of Chinese Academy of Sciences (China)
Dafu Liu, Shanghai Institute of Technical Physics of the Chinese Academy of Sciences (China)
Haimei Gong, Shanghai Institute of Technical Physics of the Chinese Academy of Sciences (China)


Published in SPIE Proceedings Vol. 10462:
AOPC 2017: Optical Sensing and Imaging Technology and Applications
Yadong Jiang; Haimei Gong; Weibiao Chen; Jin Li, Editor(s)

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