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Proceedings Paper

Lithography equipment
Author(s): Harry J. Levinson
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Paper Abstract

Until recently, lithography capability evolved consistently with Moore's law. It appears that semiconductor manufacturers are now deviating from Moore's law, which has implications for lithography equipment. DUV lithography is moving into production in a mix-and-match environment. Step- and-scan technology is the wave of the near- future, as a way to contend with the difficulty of manufacturing wide-field lenses. Resist processing equipment will undergo few fundamental changes, but will often be integrated with steppers, particularly for DUV applications. Metrology is being stretched beyond its limits for technologies below 250 nm. The move is on to 300 =I diameter wafers, and 193 nm lithography is under consideration.

Paper Details

Date Published: 30 August 2017
PDF: 25 pages
Proc. SPIE 10321, Single Frequency Semiconductor Lasers, 1032102 (30 August 2017); doi: 10.1117/12.2284081
Show Author Affiliations
Harry J. Levinson, Advanced Micro Devices (United States)

Published in SPIE Proceedings Vol. 10321:
Single Frequency Semiconductor Lasers
Jens Buus, Editor(s)

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