Share Email Print

Proceedings Paper

Laser beam soldering of micro-optical components
Author(s): R. Eberhardt
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

MOTIVATION Ongoing miniaturisation and higher requirements within optical assemblies and the processing of temperature sensitive components demands for innovative selective joining techniques. So far adhesive bonding has primarily been used to assemble and adjust hybrid micro optical systems. However, the properties of the organic polymers used for the adhesives limit the application of these systems. In fields of telecommunication and lithography, an enhancement of existing joining techniques is necessary to improve properties like humidity resistance, laserstability, UV-stability, thermal cycle reliability and life time reliability. Against this background laser beam soldering of optical components is a reasonable joining technology alternative. Properties like: - time and area restricted energy input - energy input can be controlled by the process temperature - direct and indirect heating of the components is possible - no mechanical contact between joining tool and components give good conditions to meet the requirements on a joining technology for sensitive optical components. Additionally to the laser soldering head, for the assembly of optical components it is necessary to include positioning units to adjust the position of the components with high accuracy before joining. Furthermore, suitable measurement methods to characterize the soldered assemblies (for instance in terms of position tolerances) need to be developed.

Paper Details

Date Published: 19 May 2003
PDF: 3 pages
Proc. SPIE 10314, Optifab 2003: Technical Digest, 103141G (19 May 2003); doi: 10.1117/12.2284041
Show Author Affiliations
R. Eberhardt, Fraunhofer-Institute for Applied Optics and Precision Engineering (Germany)

Published in SPIE Proceedings Vol. 10314:
Optifab 2003: Technical Digest
Walter C. Czajkowski; Toshihide Dohi; Hans Lauth; Harvey M. Pollicove, Editor(s)

© SPIE. Terms of Use
Back to Top