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Proceedings Paper

Mirror grinding of silicon with EPD pellets: applying a constant pressure machining
Author(s): Hideo Shibutani
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Paper Abstract

In this study, a fine abrasive grinding wheel, called EPD pellet, was fabricated and a silicon wafer was ground with constant pressure machining. Constant pressure grinding with silica EPD pellets made a mirror surface about 3.4 nmRa on the silicon wafers. The highest grinding ratio was about 2.0, twice as much as case of ordinary constant infeed grinding.

Paper Details

Date Published: 19 May 2003
PDF: 4 pages
Proc. SPIE 10314, Optifab 2003: Technical Digest, 103140H (19 May 2003); doi: 10.1117/12.2284006
Show Author Affiliations
Hideo Shibutani, Toyohashi Univ. of Technology (Japan)


Published in SPIE Proceedings Vol. 10314:
Optifab 2003: Technical Digest
Walter C. Czajkowski; Toshihide Dohi; Hans Lauth; Harvey M. Pollicove, Editor(s)

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