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Proceedings Paper

New multiwire Fixed Abrasive Slicing Technology (FAST)
Author(s): Frederick Schmid
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Paper Abstract

A new multiwire Fixed Abrasive Slicing Technology (FAST) was developed that combines the low kerf loss and high material utilization of multiwire slicing (MWS), low consumable costs of internal diameter (ID) slicing and low cost of multiblade slicing (MBS) technologies. Recent improvements in FAST allow it to be utilized for effective slicing of hard materials at low cost. For over two years, 2-inch diameter sapphire has been sliced in prototype mode for supplying wafers to the industry.

Paper Details

Date Published: 19 May 2003
PDF: 3 pages
Proc. SPIE 10314, Optifab 2003: Technical Digest, 103140G (19 May 2003); doi: 10.1117/12.2284005
Show Author Affiliations
Frederick Schmid, Crystal Systems, Inc. (United States)

Published in SPIE Proceedings Vol. 10314:
Optifab 2003: Technical Digest
Walter C. Czajkowski; Toshihide Dohi; Hans Lauth; Harvey M. Pollicove, Editor(s)

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