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Challenges in the optical alignment of optoelectronic components
Author(s): Amelia G. Grobnic
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Paper Abstract

The packaging of optoelectronic components presents many challenges related to the optical alignment of optical and optoelectronic components, due to very precise placement requirements, the demand for long term reliability and environmental insensitivity, and also for a fast and cost effective packaging process. This paper focuses on techniques used for precise optical alignment and the challenges related to their use, analyzed in the context of the whole optoelectronics packaging process.

Paper Details

Date Published: 29 August 2017
PDF: 3 pages
Proc. SPIE 10313, Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging, 103134Z (29 August 2017); doi: 10.1117/12.2283975
Show Author Affiliations
Amelia G. Grobnic, Communications Research Ctr. Canada (Canada)


Published in SPIE Proceedings Vol. 10313:
Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging
John C. Armitage, Editor(s)

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