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Proceedings Paper

Industrial scale processing of materials in the manufacture of microelectronic devices
Author(s): Jim Higgins
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Paper Abstract

This paper will discuss the application of laser technology to two areas that require mass production techniques in the manufacture of printed circuit or printed wiring boards (PCB/PWB). These result from the increasing degree to which the packing densities of components and tracks is required to increase keep pace with the rapid expansion of the input/output (1/0) functionality that is placed upon individual boards.

Paper Details

Date Published: 29 August 2017
PDF: 2 pages
Proc. SPIE 10313, Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging, 1031328 (29 August 2017); doi: 10.1117/12.2283876
Show Author Affiliations
Jim Higgins, GSI Lumonics, Inc. (Canada)


Published in SPIE Proceedings Vol. 10313:
Opto-Canada: SPIE Regional Meeting on Optoelectronics, Photonics, and Imaging
John C. Armitage, Editor(s)

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