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Proceedings Paper

Design of high precision temperature control system for TO packaged LD
Author(s): Enji Liang; Baoke Luo; Bin Zhuang; Zhengquan He
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Paper Abstract

Temperature is an important factor affecting the performance of TO package LD. In order to ensure the safe and stable operation of LD, a temperature control circuit for LD based on PID technology is designed. The MAX1978 and an external PID circuit are used to form a control circuit that drives the thermoelectric cooler (TEC) to achieve control of temperature and the external load can be changed. The system circuit has low power consumption, high integration and high precision,and the circuit can achieve precise control of the LD temperature. Experiment results show that the circuit can achieve effective and stable control of the laser temperature.

Paper Details

Date Published: 24 October 2017
PDF: 10 pages
Proc. SPIE 10458, AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, 104581Y (24 October 2017); doi: 10.1117/12.2283461
Show Author Affiliations
Enji Liang, Xi'an Institute of Optics and Precision Mechanics (China)
Shaanxi Normal Univ. (China)
Baoke Luo, Xi'an Institute of Optics and Precision Mechanics (China)
Bin Zhuang, Xi'an Institute of Optics and Precision Mechanics (China)
Zhengquan He, Xi'an Institute of Optics and Precision Mechanics (China)


Published in SPIE Proceedings Vol. 10458:
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing
Wolfgang Osten; Anand Krishna Asundi; Huijie Zhao, Editor(s)

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