Share Email Print

Proceedings Paper

Design of 1024x3 ROIC with TDI for scanning type IRFPA imaging
Author(s): Gongyuan Zhao; Mao Ye; Kai Hu; Yiqiang Zhao
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Design of a multispectral infrared focal plane array ROIC (readout integrated circuit) with TDI (time delay integration) is presented. A 3 SNR improvement can be achieved by a 3 pixels TDI implementation. The 3 pixel signals in each channel are firstly integrated by 3 CTIA structures, then the TDI action is in SC-AMP (switch capacitor amplifier) of each channel. A novel switch capacitor amplifier topology is proposed which can both reduce power dissipation by shutting down the AMP and realize offset voltage cancellation. Besides, bad pixel replacement is realized by an alternative gain of the SC-AMP. The proposed ROIC can work well both room and cryogenic temperature. Simulation results show that the CTIA input stage have a good linearity of 99.721% (post-layout sim) over 2.8V output span.

Paper Details

Date Published: 24 October 2017
PDF: 7 pages
Proc. SPIE 10462, AOPC 2017: Optical Sensing and Imaging Technology and Applications, 104620W (24 October 2017); doi: 10.1117/12.2282932
Show Author Affiliations
Gongyuan Zhao, Tianjin Univ. (China)
Mao Ye, Tianjin Univ. (China)
Kai Hu, Tianjin Univ. (China)
Yiqiang Zhao, Tianjin Univ. (China)

Published in SPIE Proceedings Vol. 10462:
AOPC 2017: Optical Sensing and Imaging Technology and Applications
Yadong Jiang; Haimei Gong; Weibiao Chen; Jin Li, Editor(s)

© SPIE. Terms of Use
Back to Top