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Proceedings Paper

X-ray mask fabrication techniques for micromachining
Author(s): Yuli Vladimirsky; Olga Vladimirsky; Volker Saile; Kevin J. Morris; J. Michael Klopf
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Paper Abstract

In this paper we present specifics of x-ray mask fabrication suitable for high-aspect ratio microlithography in micromachining. Results of fabrication and exposures using x-ray masks with approximately 4 micrometer thick gold absorber (one level resist) are illustrated. For conventional x-ray masks commercially available substrates were used: B-doped Si membrane (2-3 micrometers thick) on a 4' Si wafer bonded to a Pyrex glass ring. A new approach -- the transfer mask technique -- is demonstrated. This technique is based on forming an absorber pattern directly onto the resist surface of the sample. The transfer mask method is suitable for any radiation (visible, UV, and x-rays) and is based on the use of a master mask (optical or x- ray) to achieve patterns with desired aspect ratio. When used in conjunction with multiple x- ray exposures and sequential developments the transfer mask method produces patterns with extremely high aspect ratio.

Paper Details

Date Published: 8 December 1995
PDF: 7 pages
Proc. SPIE 2621, 15th Annual BACUS Symposium on Photomask Technology and Management, (8 December 1995); doi: 10.1117/12.228193
Show Author Affiliations
Yuli Vladimirsky, Louisiana State Univ. (United States)
Olga Vladimirsky, Louisiana State Univ. (United States)
Volker Saile, Louisiana State Univ. (United States)
Kevin J. Morris, Louisiana State Univ. (United States)
J. Michael Klopf, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 2621:
15th Annual BACUS Symposium on Photomask Technology and Management
Gilbert V. Shelden; James N. Wiley, Editor(s)

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