Share Email Print

Proceedings Paper

Quality assurance of dielectric masks for laser ablation technology
Author(s): Doris Pulaski; Rajesh S. Patel; James L. Speidell
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Dielectric masks are one of several types of masks used for high energy excimer laser ablation. Excimer laser ablation is a process used to directly pattern materials without the use of resists or wet processing. The dielectric masks are formed from a multilayer stack of dielectric films deposited on a quartz substrate. These masks have low reflectivity in visible light, and the dielectric stack thickness ranges from 0.4 micrometer to 1.0 micrometer to achieve an optimum reflectivity for a specific application. These properties present the most significant challenges in the inspection and quality assurance of dielectric masks. This paper discusses the methods of critical dimension measurement and defect inspection that have been developed for dielectric laser ablation masks. Printability of defects and the application of a unique scanning inspection tool which uses ultraviolet light are discussed. Manufacturing performance data also are presented.

Paper Details

Date Published: 8 December 1995
PDF: 12 pages
Proc. SPIE 2621, 15th Annual BACUS Symposium on Photomask Technology and Management, (8 December 1995); doi: 10.1117/12.228191
Show Author Affiliations
Doris Pulaski, IBM Microelectronics (United States)
Rajesh S. Patel, IBM Microelectronics (United States)
James L. Speidell, IBM Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 2621:
15th Annual BACUS Symposium on Photomask Technology and Management
Gilbert V. Shelden; James N. Wiley, Editor(s)

© SPIE. Terms of Use
Back to Top