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Proceedings Paper

Evaluating mechanical characteristic of SiNx EUV pellicle membrane (Conference Presentation)
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Paper Abstract

Various materials and structures have been studied to improve the mechanical and thermal properties of extremely thin membrane of EUV pellicle. We are developing pellicle membranes based on silicon nitride because silicon nitride is known to be stronger than silicon (e.g., Young’s modulus of bulk material: ~300 GPa vs. ~150 GPa). Mechanical strength is required to guarantee the durability under mask stage acceleration and venting/pumping process. However, it is difficult to characterize the mechanical properties of nano-scale membrane such as Young’s modulus, Poisson’s ratio and fracture strength. In this paper, mechanical properties of silicon nitride membranes with thickness less than 50nm were characterized by bulge test, tensile test and nano-indentation. Specially-designed ‘push-to-pull device’ was used to obtain stress-strain curve of silicon nitride membrane with 1.54 µm width and 2.45 µm length, and the Young’s modulus of ~93GPa and tensile strength of 3.2GPa were obtained. Bulge-test were performed on silicon nitride membrane with 1 x 1 cm2 size, and the deformation of membrane induced by pressure load was monitored by laser displacement sensor with 0.1 μm resolution. And the data points were fitted to the theoretical equation modified for square membrane and the Young’s modulus of ~ 200 GPa was obtained. This value is higher than the one obtained by tensile test but lower than the bulk value. The detailed explanation of experimental data will be discussed during the presentation.

Paper Details

Date Published: 16 October 2017
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Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 104500T (16 October 2017); doi: 10.1117/12.2281683
Show Author Affiliations
Yong Ju Jang, Hanyang Univ. (Korea, Republic of)
Jung Hwan Kim, Hanyang Univ. (Korea, Republic of)
Jin-ho Ahn, Hanyang Univ. (Korea, Republic of)


Published in SPIE Proceedings Vol. 10450:
International Conference on Extreme Ultraviolet Lithography 2017
Paolo A. Gargini; Patrick P. Naulleau; Kurt G. Ronse; Toshiro Itani, Editor(s)

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