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Proceedings Paper

EUV local CDU healing performance and modeling capability towards 5nm node
Author(s): Tae Kwon Jee; Vadim Timoshkov; Peter Choi; David Rio; Yu-Cheng Tsai; Hidetami Yaegashi; Kyohei Koike; Carlos Fonseca; Stijn Schoofs
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Paper Abstract

Both local variability and optical proximity correction (OPC) errors are big contributors to the edge placement error (EPE) budget which is closely related to the device yield. The post-litho contact hole healing will be demonstrated to meet after-etch local variability specifications using a low dose, 30mJ/cm2 dose-to-size, positive tone developed (PTD) resist with relevant throughput in high volume manufacturing (HVM). The total local variability of the node 5nm (N5) contact holes will be characterized in terms of local CD uniformity (LCDU), local placement error (LPE), and contact edge roughness (CER) using a statistical methodology. The CD healing process has complex etch proximity effects, so the OPC prediction accuracy is challenging to meet EPE requirements for the N5. Thus, the prediction accuracy of an after-etch model will be investigated and discussed using ASML Tachyon OPC model.

Paper Details

Date Published: 16 October 2017
PDF: 9 pages
Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 1045017 (16 October 2017); doi: 10.1117/12.2281627
Show Author Affiliations
Tae Kwon Jee, ASML Netherlands B.V. (Netherlands)
Vadim Timoshkov, ASML Netherlands B.V. (Netherlands)
Peter Choi, ASML Brion (United States)
David Rio, ASML Brion (United States)
Yu-Cheng Tsai, ASML Brion (United States)
Hidetami Yaegashi, Tokyo Electron Ltd. (Japan)
Kyohei Koike, Tokyo Electron Ltd. (Japan)
Carlos Fonseca, Tokyo Electron America, Inc. (United States)
Stijn Schoofs, IMEC (Belgium)


Published in SPIE Proceedings Vol. 10450:
International Conference on Extreme Ultraviolet Lithography 2017
Paolo A. Gargini; Patrick P. Naulleau; Kurt G. Ronse; Toshiro Itani, Editor(s)

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