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Coater/developer based techniques to improve high-resolution EUV patterning defectivity
Author(s): Koichi Hontake; Lior Huli; Corey Lemley; Dave Hetzer; Eric Liu; Akiteru Ko; Shinichiro Kawakami; Takeshi Shimoaoki; Yusaku Hashimoto; Koichiro Tanaka; Karen Petrillo; Luciana Meli; Anuja De Silva; Yongan Xu; Nelson Felix; Richard Johnson; Cody Murray; Alex Hubbard
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Paper Abstract

Extreme ultraviolet lithography (EUVL) technology is one of the leading candidates under consideration for enabling the next generation of devices, for 7nm node and beyond. As the focus shifts to driving down the 'effective' k1 factor and enabling the full scaling entitlement of EUV patterning, new techniques and methods must be developed to reduce the overall defectivity, mitigate pattern collapse, and eliminate film-related defects. In addition, CD uniformity and LWR/LER must be improved in terms of patterning performance. Tokyo Electron Limited (TEL™) and IBM Corporation are continuously developing manufacturing quality processes for EUV. In this paper, we review the ongoing progress in coater/developer based processes (coating, developing, baking) that are required to enable EUV patterning.

Paper Details

Date Published: 16 October 2017
PDF: 6 pages
Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 104501U (16 October 2017); doi: 10.1117/12.2280506
Show Author Affiliations
Koichi Hontake, TEL Technology Ctr., America, LLC (United States)
Lior Huli, TEL Technology Ctr., America, LLC (United States)
Corey Lemley, TEL Technology Ctr., America, LLC (United States)
Dave Hetzer, TEL Technology Ctr., America, LLC (United States)
Eric Liu, TEL Technology Ctr., America, LLC (United States)
Akiteru Ko, TEL Technology Ctr., America, LLC (United States)
Shinichiro Kawakami, Tokyo Electron Kyushu Ltd. (Japan)
Takeshi Shimoaoki, Tokyo Electron Kyushu Ltd. (Japan)
Yusaku Hashimoto, Tokyo Electron Kyushu Ltd. (Japan)
Koichiro Tanaka, Tokyo Electron Kyushu Ltd. (Japan)
Karen Petrillo, IBM Corp. (United States)
Luciana Meli, IBM Corp. (United States)
Anuja De Silva, IBM Corp. (United States)
Yongan Xu, IBM Corp. (United States)
Nelson Felix, IBM Corp. (United States)
Richard Johnson, IBM Corp. (United States)
Cody Murray, IBM Corp. (United States)
Alex Hubbard, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 10450:
International Conference on Extreme Ultraviolet Lithography 2017
Paolo A. Gargini; Patrick P. Naulleau; Kurt G. Ronse; Toshiro Itani, Editor(s)

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