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Impact of slurry pH on material removal rate and surface quality of polished fused silica
Author(s): Melanie Redien; Cedric Maunier; Bertrand Remy; Karine Poliakoff-Leriche; Jerome Neauport
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Paper Abstract

We have selected and characterized 2 cerium oxide slurries. We have then modified their pH to polish fused silica samples. The material removal rate, roughness, surface defects density and morphology have been observed as a function of pH. We noticed that while roughness and surface defect density don’t seem to be very affected by slurry pH, the latter has an influence on material removal rate and width of the scratches generated during polishing.

Paper Details

Date Published: 16 October 2017
PDF: 5 pages
Proc. SPIE 10448, Optifab 2017, 104480F (16 October 2017); doi: 10.1117/12.2279798
Show Author Affiliations
Melanie Redien, Commissariat à l'Énergie Atomique et aux Energies Alternatives (France)
Ctr. d'Etudes Scientifiques et Techniques d'Aquitaine (France)
Cedric Maunier, Commissariat à l'Énergie Atomique et aux Energies Alternatives (France)
Ctr. d'Etudes Scientifiques et Techniques d'Aquitaine (France)
Bertrand Remy, Commissariat à l'Énergie Atomique et aux Energies Alternatives (France)
Ctr. d'Etudes Scientifiques et Techniques d'Aquitaine (France)
Karine Poliakoff-Leriche, Commissariat à l'Énergie Atomique et aux Energies Alternatives (France)
Jerome Neauport, Commissariat à l'Énergie Atomique et aux Energies Alternatives (France)
Ctr. d'Etudes Scientifiques et Techniques d'Aquitaine (France)


Published in SPIE Proceedings Vol. 10448:
Optifab 2017
Julie L. Bentley; Sebastian Stoebenau, Editor(s)

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