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Proceedings Paper

Methods for fabrication of flexible hybrid electronics
Author(s): Robert A. Street; Ping Mei; Brent Krusor; Steve E. Ready; Yong Zhang; David E. Schwartz; Adrien Pierre; Sean E. Doris; Beverly Russo; Siv Kor; Janos Veres
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Paper Abstract

Printed and flexible hybrid electronics is an emerging technology with potential applications in smart labels, wearable electronics, soft robotics, and prosthetics. Printed solution-based materials are compatible with plastic film substrates that are flexible, soft, and stretchable, thus enabling conformal integration with non-planar objects. In addition, manufacturing by printing is scalable to large areas and is amenable to low-cost sheet-fed and roll-to-roll processes. FHE includes display and sensory components to interface with users and environments. On the system level, devices also require electronic circuits for power, memory, signal conditioning, and communications. Those electronic components can be integrated onto a flexible substrate by either assembly or printing. PARC has developed systems and processes for realizing both approaches. This talk presents fabrication methods with an emphasis on techniques recently developed for the assembly of off-the-shelf chips. A few examples of systems fabricated with this approach are also described.

Paper Details

Date Published: 25 August 2017
PDF: 6 pages
Proc. SPIE 10366, Hybrid Memory Devices and Printed Circuits 2017, 103660C (25 August 2017); doi: 10.1117/12.2275561
Show Author Affiliations
Robert A. Street, Palo Alto Research Ctr. (United States)
Ping Mei, Palo Alto Research Ctr. (United States)
Brent Krusor, Palo Alto Research Ctr. (United States)
Steve E. Ready, Palo Alto Research Ctr. (United States)
Yong Zhang, Palo Alto Research Ctr. (United States)
David E. Schwartz, Palo Alto Research Ctr. (United States)
Adrien Pierre, Palo Alto Research Ctr. (United States)
Sean E. Doris, Palo Alto Research Ctr. (United States)
Beverly Russo, Palo Alto Research Ctr. (United States)
Siv Kor, Palo Alto Research Ctr. (United States)
Janos Veres, Palo Alto Research Ctr. (United States)


Published in SPIE Proceedings Vol. 10366:
Hybrid Memory Devices and Printed Circuits 2017
Emil J. W. List-Kratochvil, Editor(s)

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