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Life test of the InGaAs focal plane arrays detector for space applications
Author(s): Xian-Liang Zhu; Hai-Yan Zhang; Xue Li; Zhang-Cheng Huang; Hai-Mei Gong
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Paper Abstract

The short-wavelength infrared (SWIR) InGaAs focal plane array (FPA) detector consists of infrared detector chip, readout integrated circuit (ROIC), and flip-chip bonding interconnection by Indium bump. In order to satisfy space application requirements for failure rates or Mean Time to Failure (MTTF), which can only be demonstrated with the large number of detectors manufactured, the single pixel in InGaAs FPAs was chosen as the research object in this paper. The constant-stress accelerated life tests were carried out at 70°C,80°C,90°C and100°C. The failed pixels increased gradually during more than 14000 hours at each elevated temperatures. From the random failure data the activation energy was estimated to be 0.46eV, and the average lifetime of a single pixel in InGaAs FPAs was estimated to be longer than 1E+7h at the practical operating temperature (5°C).

Paper Details

Date Published: 30 August 2017
PDF: 6 pages
Proc. SPIE 10404, Infrared Sensors, Devices, and Applications VII, 104040E (30 August 2017); doi: 10.1117/12.2273591
Show Author Affiliations
Xian-Liang Zhu, Shanghai Institute of Technical Physics (China)
Hai-Yan Zhang, Shanghai Institute of Technical Physics (China)
Xue Li, Shanghai Institute of Technical Physics (China)
Zhang-Cheng Huang, Shanghai Institute of Technical Physics (China)
Hai-Mei Gong, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 10404:
Infrared Sensors, Devices, and Applications VII
Paul D. LeVan; Ashok K. Sood; Priyalal Wijewarnasuriya; Arvind I. D'Souza, Editor(s)

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