Share Email Print
cover

Proceedings Paper

Analysis of photonic spot profile converter and bridge structure on SOI platform for horizontal and vertical integration
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Horizontal spot size converter required for horizontal light coupling and vertical bridge structure required for vertical integration are designed on high index contrast SOI platform in order to form more compact integrated photonic circuits. Both the structures are based on the concept of multimode interference. The spot size converter can be realized by successive integration of multimode interference structures with reducing dimension on horizontal plane, whereas the optical bridge structure consists of a number of vertical multimode interference structure connected by single mode sections. The spot size converter can be modified to a spot profile converter when the final single mode waveguide is replaced by a slot waveguide. Analysis have shown that by using three multimode sections in a spot size converter, an Gaussian input having spot diameter of 2.51 μm can be converted to a spot diameter of 0.25 μm. If the output single mode section is replaced by a slot waveguide, this input profile can be converted to a flat top profile of width 50 nm. Similarly, vertical displacement of 8μm is possible by using a combination of two multimode sections and three single mode sections in the vertical bridge structure. The analyses of these two structures are carried out for both TE and TM modes at 1550 nm wavelength using the semi analytical matrix method which is simple and fast in computation time and memory. This work shows that the matrix method is equally applicable for analysis of horizontally as well as vertically integrated photonic circuit.

Paper Details

Date Published: 23 August 2017
PDF: 7 pages
Proc. SPIE 10382, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XI, 1038203 (23 August 2017); doi: 10.1117/12.2272565
Show Author Affiliations
Saikat Majumder, Univ. of Calcutta (India)
Techno India (India)
Amit Kr. Jha, Techno India (India)
Aishik Biswas, Techno India (India)
Debasmita Banerjee, Techno India (India)
Dipankar Ganguly, Techno India (India)
Rajib Chakraborty, Univ. of Calcutta (India)


Published in SPIE Proceedings Vol. 10382:
Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XI
Shizhuo Yin; Ruyan Guo, Editor(s)

© SPIE. Terms of Use
Back to Top