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Mass production compatible fabrication techniques of single-crystalline silver metamaterials and plasmonics devices
Author(s): Ilya A. Rodionov; Alexander S. Baburin; Alexander V. Zverev; Ivan A. Philippov; Aidar R. Gabidulin; Alina A. Dobronosova; Elena V. Ryzhova; Alexey P. Vinogradov; Anton I. Ivanov; Sergey S. Maklakov; Alexander V. Baryshev; Igor V. Trofimov; Alexander M. Merzlikin; Nikolay A. Orlikovsky; Ilya A. Rizhikov
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Paper Abstract

During last 20 years, great results in metamaterials and plasmonic nanostructures fabrication were obtained. However, large ohmic losses in metals and mass production compatibility still represent the most serious challenge that obstruct progress in the fields of metamaterials and plasmonics. Many recent research are primarily focused on developing low-loss alternative materials, such as nitrides, II–VI semiconductor oxides, high-doped semiconductors, or two-dimensional materials. In this work, we demonstrate that our perfectly fabricated silver films can be an effective low-loss material system, as theoretically well-known. We present a fabrication technology of plasmonic and metamaterial nanodevices on transparent (quartz, mica) and non-transparent (silicon) substrates by means of e-beam lithography and ICP dry etch instead of a commonly-used focused ion beam (FIB) technology. We eliminate negative influence of litho-etch steps on silver films quality and fabricate square millimeter area devices with different topologies and perfect sub-100 nm dimensions reproducibility. Our silver non-damage fabrication scheme is tested on trial manufacture of spasers, plasmonic sensors and waveguides, metasurfaces, etc. These results can be used as a flexible device manufacture platform for a broad range of practical applications in optoelectronics, communications, photovoltaics and biotechnology.

Paper Details

Date Published: 24 August 2017
PDF: 7 pages
Proc. SPIE 10343, Metamaterials, Metadevices, and Metasystems 2017, 1034337 (24 August 2017); doi: 10.1117/12.2271643
Show Author Affiliations
Ilya A. Rodionov, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Alexander S. Baburin, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Alexander V. Zverev, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Ivan A. Philippov, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Aidar R. Gabidulin, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Alina A. Dobronosova, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Elena V. Ryzhova, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Alexey P. Vinogradov, All-Russian Research Institute of Automatics (Russian Federation)
Institute for Theoretical and Applied Electrodynamics (Russian Federation)
Anton I. Ivanov, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Sergey S. Maklakov, Institute for Theoretical and Applied Electrodynamics (Russian Federation)
Alexander V. Baryshev, All-Russian Research Institute of Automatics (Russian Federation)
Igor V. Trofimov, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Institute for Theoretical and Applied Electrodynamics (Russian Federation)
Alexander M. Merzlikin, All-Russian Research Institute of Automatics (Russian Federation)
Institute for Theoretical and Applied Electrodynamics (Russian Federation)
Nikolay A. Orlikovsky, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Ilya A. Rizhikov, Bauman Moscow State Technical Univ. (Russian Federation)
All-Russian Research Institute of Automatics (Russian Federation)
Institute for Theoretical and Applied Electrodynamics (Russian Federation)


Published in SPIE Proceedings Vol. 10343:
Metamaterials, Metadevices, and Metasystems 2017
Nader Engheta; Mikhail A. Noginov; Nikolay I. Zheludev, Editor(s)

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