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Proceedings Paper

Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication
Author(s): Krzysztof Nieweglowski; Tobias Tiedje; David Schöniger; Ronny Henker; Frank Ellinger; Karlheinz Bock
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Paper Abstract

This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on planar polymeric optical multimode waveguides with integrated out-of-plane coupling optics and optical transceiver subassemblies based on glass interposer. Integration of polymeric waveguides on flexible substrates will be shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electrooptical printed circuit board (EOPCB). Realized on-board waveguides feature low insertion loss (minimum attenuation coefficient of below 0.1 dB/cm). For short planar waveguides (Lwaveguide = 9 cm) error free transmission (BER < 10-12) up to 30 Gbit/s was achieved. The development of glass interposer passive optical coupling structures for VCSEL-based short-distance links will be described.

Paper Details

Date Published: 10 February 2017
PDF: 7 pages
Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250V (10 February 2017); doi: 10.1117/12.2271046
Show Author Affiliations
Krzysztof Nieweglowski, TU Dresden (Germany)
Tobias Tiedje, TU Dresden (Germany)
David Schöniger, TU Dresden (Germany)
Ronny Henker, TU Dresden (Germany)
Frank Ellinger, TU Dresden (Germany)
Karlheinz Bock, TU Dresden (Germany)


Published in SPIE Proceedings Vol. 10325:
Optical Fibers and Their Applications 2017
Jan Dorosz; Ryszard S. Romaniuk, Editor(s)

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