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Snapshot hyperspectral imaging probe with principal component analysis and confidence ellipse for classification
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Paper Abstract

Hyperspectral imaging combines imaging and spectroscopy to provide detailed spectral information for each spatial point in the image. This gives a three-dimensional spatial-spatial-spectral datacube with hundreds of spectral images. Probe-based hyperspectral imaging systems have been developed so that they can be used in regions where conventional table-top platforms would find it difficult to access. A fiber bundle, which is made up of specially-arranged optical fibers, has recently been developed and integrated with a spectrograph-based hyperspectral imager. This forms a snapshot hyperspectral imaging probe, which is able to form a datacube using the information from each scan. Compared to the other configurations, which require sequential scanning to form a datacube, the snapshot configuration is preferred in real-time applications where motion artifacts and pixel misregistration can be minimized. Principal component analysis is a dimension-reducing technique that can be applied in hyperspectral imaging to convert the spectral information into uncorrelated variables known as principal components. A confidence ellipse can be used to define the region of each class in the principal component feature space and for classification. This paper demonstrates the use of the snapshot hyperspectral imaging probe to acquire data from samples of different colors. The spectral library of each sample was acquired and then analyzed using principal component analysis. Confidence ellipse was then applied to the principal components of each sample and used as the classification criteria. The results show that the applied analysis can be used to perform classification of the spectral data acquired using the snapshot hyperspectral imaging probe.

Paper Details

Date Published: 13 June 2017
PDF: 6 pages
Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104491O (13 June 2017); doi: 10.1117/12.2270736
Show Author Affiliations
Hoong-Ta Lim, Nanyang Technological Univ. (Singapore)
Vadakke Matham Murukeshan, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 10449:
Fifth International Conference on Optical and Photonics Engineering
Anand Krishna Asundi, Editor(s)

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